JPH047102B2 - - Google Patents

Info

Publication number
JPH047102B2
JPH047102B2 JP3954383A JP3954383A JPH047102B2 JP H047102 B2 JPH047102 B2 JP H047102B2 JP 3954383 A JP3954383 A JP 3954383A JP 3954383 A JP3954383 A JP 3954383A JP H047102 B2 JPH047102 B2 JP H047102B2
Authority
JP
Japan
Prior art keywords
frame
inert gas
lead frame
bonding
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3954383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59165429A (ja
Inventor
Hisataka Akimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58039543A priority Critical patent/JPS59165429A/ja
Publication of JPS59165429A publication Critical patent/JPS59165429A/ja
Publication of JPH047102B2 publication Critical patent/JPH047102B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58039543A 1983-03-10 1983-03-10 還元方法 Granted JPS59165429A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58039543A JPS59165429A (ja) 1983-03-10 1983-03-10 還元方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58039543A JPS59165429A (ja) 1983-03-10 1983-03-10 還元方法

Publications (2)

Publication Number Publication Date
JPS59165429A JPS59165429A (ja) 1984-09-18
JPH047102B2 true JPH047102B2 (en]) 1992-02-07

Family

ID=12555963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58039543A Granted JPS59165429A (ja) 1983-03-10 1983-03-10 還元方法

Country Status (1)

Country Link
JP (1) JPS59165429A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9415456B2 (en) 2012-10-05 2016-08-16 Shinkawa Ltd. Antioxidant gas blow-off unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02140848U (en]) * 1989-04-25 1990-11-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9415456B2 (en) 2012-10-05 2016-08-16 Shinkawa Ltd. Antioxidant gas blow-off unit
JPWO2014054305A1 (ja) * 2012-10-05 2016-08-25 株式会社新川 酸化防止ガス吹き出しユニット

Also Published As

Publication number Publication date
JPS59165429A (ja) 1984-09-18

Similar Documents

Publication Publication Date Title
JP2001015545A (ja) ワイヤボンディング装置及び方法
JPH047102B2 (en])
JPH0531231U (ja) ワイヤボンダーのヒータブロツク
US5265788A (en) Bonding machine with oxidization preventive means
JP2668738B2 (ja) ワーク加熱装置
JPH0629331A (ja) ダイボンディング装置
JPH1126493A (ja) ワイヤボンディング装置
JPH04139864A (ja) 半導体装置
JP2668739B2 (ja) キュア装置
JPS6333852A (ja) 半導体素子の封止構造
JP2668737B2 (ja) キュア装置
JPH0510357Y2 (en])
JPH04256348A (ja) 冷却モジュール構造
JP2859349B2 (ja) ワイヤボンディング装置
JP2557998Y2 (ja) キャップシール装置のヒートトンネル加熱構造
JPH0298948A (ja) ダイボンダ用の樹脂硬化装置
JP2902135B2 (ja) ワイヤボンダの雰囲気構造
JPH04142042A (ja) 半導体装置の製造方法
JP2582012Y2 (ja) ウェーハ加熱用ヒータ
JPH0448738A (ja) ダイボンド装置
JPS6235632A (ja) ボンデイング装置
JP2970115B2 (ja) 半導体の製造方法
KR0164131B1 (ko) 와이어 본딩용 히터 블럭
JPH01198038A (ja) 半導体製造装置
JP2748169B2 (ja) 半導体素子製造ラインにおける硬化炉装置